An inkless wafer map is a digital method for identifying and tracking good and bad dies on a semiconductor wafer without physically marking them with ink. It replaces traditional ink-based binning with electronic mapping, enabling cleaner, more automated, and traceable wafer sort and assembly processes.
- Traditional method: Dies that fail wafer sort are physically marked with ink to prevent them from being packaged.
- Inkless method: Instead of ink, a digital wafer map records pass/fail status and bin codes for each die.
- Format: Typically a standardized file (e.g., WID, KLARF, XML) shared between wafer sort and assembly/test equipment.
