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padcom/Readme.md

Last active October 31, 2018 02:05
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Procedure for preparation of PCB using light-sensitive foil.
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Readme.md
  1. Prepare the layout
  2. Plot it in KiCAD to PDF inverted and mirrored. Print it on Canson calque. What is black on the printout will be removed from the copper layer.
  3. Cut out the layout to the size of the PCB
  4. Cut a piece of light-sensitive foil about 5mm wider and 10mm longer than the size of the PCB
  5. Clean the PCB
  6. Peal of the cover foil by sticking a piece of tape to the side that is folding (the inner side)
  7. Place the foil on the PCB - the side that had the outer foil removed
  8. Make sure there are no air bubbles or dust bubbles between the foil and PCB
  9. Put the PCB between a folded sheet of paper (PCB towards the fold!) to form a sandwitch
  10. Run the sandwitch through laminator at least 3 times
  11. Remove paper from sandwitch leaving only PCB. Beware not to peal of the foil from PCB
  12. Use Density Toner to even the traces on the layout
  13. Put the printed layout toner-down on the PCB
  14. Spray the PCB with layout on it with Transparent and remove all air bubbles
  15. Cover the PCB with a plexi and make sure there are no air bubbles. If there are then you either have to litle Transparent or the field is not even.
  16. Place a 35W energy saving bulb 22cm from the PCB
  17. Turn on the light source for 12-13 minutes
  18. Remove the PCB and put it in a dark place for 10 minutes (necessary for the chemical process to finish)
  19. Remove the outer protective foil - watch out not to break the layout!
  20. Use foil developer for 2 minutes. While developing use a soft brush to remove the disolved foil. Do NOT exceed 2 minutes!
  21. Wash the PCB under warm running water and using hands delicately remove any remaining pieces of foil.
  22. Put the PCB under light for 5 minutes. That way if there are any parts of the foil lefy they will turn blue and you'll know you have to start again
  23. Put the PCB in a dark place for 5 minutes for the chemical process of hardening the foil to settle
  24. Use B327 to remove non-covered parts of the copper; Don't keep it too long.
  25. Once all the parts are disolved put the PCB under running water and wash excessively
  26. Pour acetone on the board using surface tension to flow the liquid from one side to another. Do that until the foil peels of from the traces.
  27. Wash under running water.
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