Chip package types

chip_packages.py

PACKAGE_ALIAS = {
    'DIL':    'DIP',
    'CERDIP': 'CDIP',
    'TDSP':   'TCSP',
    'UCSP':   'BGA',
    'uMAX':   'SOIC',
}   
PACKAGE_DEFAULT = {
    'BCC': 'Bump Chip Carrier',
    'BGA': 'Ball Grid Array',
    'BQFP': 'Bumpered Quad Flat Pack',
    'CBGA': 'Ceramic Ball Grid Array',
    'CCGA': 'ceramic column grid array (CGA)',
    'CDIP': 'Ceramic DIP',
    'CERDIP': 'glass sealed ceramic DIP',
    'CERPACK': 'Ceramic Package',
    'CFP': 'Ceramic Flat Pack',
    'CGA': 'Column grid array',
    'CLCC': 'Ceramic Leadless Chip Carrier',
    'COB': 'Chip on Board',
    'COF': 'Chip on Flex',
    'COG': 'Chip on Glass',
    'CPGA': 'Ceramic Pin Grid Array',
    'CQFP': 'Ceramic quad flat-pack, similar to PQFP',
    'CSOP': 'Ceramic SOP',
    'CSP': 'Chip Scale Package',
    'DIP': 'Dual Inline Package',
    'DFN': 'Dual Flat Pack, No Lead',
    'DLCC': 'Dual Lead-Less Chip Carrier (Ceramic)',
    'ETQFP': 'Exposed Thin Quad Flat Package',
    'FBGA': 'fine pitch ball grid array',
    'FCPGA': 'Flip-chip Pin Grid Array',
    'LBGA ': 'Low Profile Ball Grid Array',
    'LCC': 'Leadless Chip Carrier, contacts are recessed vertically.',
    'LCC': 'Leaded Chip Carrier',
    'LCCC': 'Leaded Ceramic Chip Carrier',
    'LLP': 'Lead Less lead frame Package',
    'LFBGA': 'low profile fine pitch ball grid array',
    'LGA': 'Land Grid Array',
    'LQFP': 'Low-profile Quad Flat Package',
    'LTCC': 'Low temperature co-fired ceramic',
    'MCM': 'Multi-Chip Module',
    'MDIP': 'Mini-DIP',
    'MELF': 'Metal Electrode Leadless Face',
    'MICRO SMD': 'a chip-size package (CSP) developed by National Semiconductor',
    'MICRO SMDXT': 'micro Surface Mount Device extended technology',
    'MICROARRAY': 'Usually refers to a chip for testing DNA',
    'MLF': 'Micro Lead Frame (also called QFN)',
    'MLP': 'Micro Leadframe Package with a 0.5 mm contact pitch, no leads',
    'MQFP': 'Metric Quad Flat Pack, a QFP package with metric pin distribution',
    'MSOP': 'Mini Small-Outline Package',
    'OBGA': 'Organic Ball Grid Array',
    'OPGA': 'Organic Pin Grid Array',
    'PAC': 'Pin Array Cartridge',   
    'PBGA': 'Plastic Ball Grid Array',
    'PDIP': 'Plastic DIP',
    'PGA': 'Pin Grid Array (also known as PPGA)',

    'PLCC': 'Plastic Leaded Chip Carrier',
    'PQFN': 'power quad flat-pack, no-leads, with exposed die-pad(s) for heatsinking',
    'PQFP': 'Plastic Quad Flat Pack QFP',
    'PSOP': 'Plastic small-outline package',
    'QFN': 'Quad Flat No Leads, also called micro lead frame (MLF).',
    'QFP': 'Quad Flat Package',
    'QIP': 'Quad Inline Package',   
    'QSOP': 'Quarter-Size Small-Outline package, with pin spacing of 0.635 mm.',
    'SBGA': 'Super BGA',
    'SDIP': 'Skinny DIP',
    'SDIP': 'Shrink DIP',
    'SOD': 'Small Outline Diode',   
    'SOIC': 'Small Outline Integrated Circuit',
    'SOP': 'Small Outline Package', 
    'SOT': 'Small Outline Transistor',
    'SSOP': 'Shrink Small-Outline Package',
    'SIP': 'Single in-line package',
    'SOIC': 'Small-outline Integrated Circuit',
    'TBGA': 'Thin Ball Grid Array', 
    'TCSP': 'True Chip Size Package (package is same size as silicon)',
    'TEPBGA': 'Thermally Enhanced Plastic BGA.',
    'TFBGA': 'Thin fine pitch BGA.',
    'TQFP': 'Thin Quad Flat Pack',  
    'TSOP': 'Thin Small-outline Package',
    'TSSOP': 'Thin Shrink Small Outline Package',
    'TVSOP': 'Thin Very Small-Outline Package',
    'uBGA': 'Micro-BGA (Ball grid array)',
    'UFBGA': 'Ultra Fine BGA',
    'VQFB': 'Very-thin Quad Flat Pack',
    'WSON': 'Very Very Thin Small Outline No Lead Package',
    'ZIP': 'Zig-zag in-line package',
}