This guide aims to design boards that pass DFM analysis, considering JLCPCB's capabilities specifications. It assumes designs of at least 4 layers, 1oz copper max thickness, and the ENIG surface finish.
These are, according to JLCPCB at the time of writing:
- Minimum track width/spacing: 0.09mm (3.5 mil) or 3 mil (0.076mm) acceptable in BGA fan-outs
- Via outer diameter: 0.1mm larger than hole (0.15mm preferred), half of that corresponds to annular width
- Drill diameter: 0.15mm (using their most expensive option)
- Via hole to hole Spacing: 0.2mm
